Industrial Products

CO2 laser-based Laser Router to designed drill vias in ceramic circuit boards for the microwave industry. The Laser Router is also used to laser machine plastic catheters and strip wires in the medical device industry.

• Introduction
• Laser Router-250
• Laser Router-400
• Laser Router-500

RapidX130

• Introduction
• RapidX130-M
• RapidX130-L

The Excimer-based OLED system is a laser ablation system for OLED displays and plastic transistors.

• OLED-300

The DPSS-based Laser Cutting systems are used to laser cut, singulate or degate polymer devices.

• Introduction
• Laser Cutter 0.5-355
• Laser Cutter 7-355

The SOLAR systems are used for via drilling of glass substrates for the solar power market.

• SOLAR 400
• SOLAR 500

The Excimer-based OLED system is a laser ablation system for OLED displays and plastic transistors.

• OLED-300

OLED Laser Ablation Tool

The Resonetics OLED Laser Ablation Series is a family of laser systems designed to meet advanced research, development, prototype, pilot production and manufacturing of Organic LEDs (OLED), Polymer LEDs (PLED) and flexible display devices. The OLED Laser Ablation system selectively patterns polymer & thin metal films on ITO/Glass and silicon substrates. The laser system exposes contact pads, wire bond pads as well as isolates and singulates individual display devices.

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The OLED Laser Ablation Series is developed to

• Maximize display life span
• Show a pathway to high volume automation
• Provide design versatility

Key System Features

• Proprietary debris nozzle designed to keep the active display area debris free
• Nitrogen process enclosure to prevent oxygen or water vapor from contaminating the display devices
• Robot effector interface to production equipment, such as polymer spinners and evaporators
• Single Stop Solution to handle from advanced research & development to high volume production
• Metrology, machine vision and auto-alignment options to maximize throughput

Laser Ablation Process

The ultra-violet laser beam etches away the overlying polymer or thin film metal from the substrate without damage. This is accomplished by a phenomena called "ablation" where the laser beam breaks the material's molecular bonds, resulting in the high velocity ejection of the "vaporized" materials into the collection path of the debris nozzle. This material removing process is done in a closed-cycle nitrogen environment to maximize the device lifespan.