Laser Systems

CO2 Laser System

• High quality cuts and precise dimensional tolerances Welded frame for stability
• Market leader in laser micromachining systems
• State of the Art Design
• The Router design allows for high duty cycle processing of a wide variety of materials.
• Ability to perform non-linear profile cutting of circles, arcs or other complex patterns.
• Proven leader in non-contact laser processing of silicon wafers and other semiconductor materials.
• A small footprint design enables easy set-up and serviceability. The unique design of the Router
  provides the maximum flexibility in any work
  environment.
• Convenient programming software to allow rapid conversion of CAD drawings to finished parts.

Innovative Features

• Non-contact laser process to cut silicon wafers and other semiconductor materials
• Cuts arcs, circles, inside cut outs,rectangles or any complex pattern
• Narrow kerf width
• Typical cutting speed 0.2”/sec (5mm/sec)
• Class 1 safety enclosure
• Optical viewing system with CCTV monitor
• Optional wafer cassette auto loading/unloading

Applications

• Silicon
• Alumina (ceramic)
• Fused silica
• Aluminum nitride
• Gallium arsenide
• CVD Diamond
• PZT ceramic
• Thin metals and oxides

Download Specification Sheet

Technical Data

System configuration: