Laser Router Series
The Resonetics Laser Router Series is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router Series is available in three (3) system configurations: Laser Router 250, Laser Router 400 and Laser Router 500, depending upon the average power of the CO2 laser. Average power of the lasers range from 250 Watts to 500 Watts with a laser repetition rates up to 100kHz.
The Laser Router offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 20mil (500 microns) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router Series is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 250
The Resonetics Laser Router 250 is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 250 is based upon a short pulse 250 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 250 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 25mil (500 microns) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 250 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 400
The Resonetics Laser Router 400 is a cost-effective short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 400 is based upon a short pulse 400 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 400 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil in a 25mil (500 micron) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 400 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 500
The Resonetics Laser Router 500 is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 500 is based upon a short pulse 500 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 500 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 25mil (500 micron) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 500 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
