Resonetics
 

Industrial Products

CO2 laser-based Laser Router to designed drill vias in ceramic circuit boards for the microwave industry. The Laser Router is also used to laser machine plastic catheters and strip wires in the medical device industry.

RapidX130

The Excimer-based OLED system is a laser ablation system for OLED displays and plastic transistors.

The DPSS-based Laser Cutting systems are used to laser cut, singulate or degate polymer devices.

The SOLAR systems are used for via drilling of glass substrates for the solar power market.

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Laser Cutter Series

The Resonetics Laser Cutter Series is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter Series is available in two (2) system configurations: Laser Cutter 0.5-355 and Laser Cutter 7-355, depending upon the average power of the DPSS laser. Average power of the lasers range from 0.5 Watts to 7 Watts with the laser wavelength of 355nm. The laser repetition rates range from 0 to 200 kHz.

The choice of laser power depends upon the process throughput requirements and cut quality.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

Laser Cutter 0.5-355

The Resonetics Laser Cutter 0.5-355 is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter 0.5-355 utilizes a DPSS laser operating at 1W at 60 KHz at a laser wavelength of 355nm.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

Laser Cutter 7-355

The Resonetics Laser Cutter 7-355 is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter 7-355 utilizes a DPSS laser operating at 7W at 60 KHz at a laser wavelength of 355nm.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

 

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Laser Cutter 0.5-355

Laser Cutter 0.5-355

Laser Cutter 7-355

Laser Cutter 7-355

 


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