Resonetics
 

Laser Systems


CO2 Laser Router
RapidX Series 130, 250, 1000
Laser Ablation Systems LDX220
Systems LDX220 Glove Box Router
MiniMed

 

Resonetics Laser Systems Division designs and manufactures turnkey laser micromachining systems for the Scientific and Industrial markets.

In addition to the standard products, the Laser Systems Division offers laser system integration services to integrate a laser source (diodepumped solid state, excimer, CO2, picoseconds and femtosecond lasers) into a turnkey workstation for customer application

 

About Laser Systems Division
Scientific Products
Industrial Products
Laser Systems Integration
Markets and Applications
Product Development

 

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Laser Cutter Series

The Resonetics Laser Cutter Series is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter Series is available in two (2) system configurations: Laser Cutter 0.5-355 and Laser Cutter 7-355, depending upon the average power of the DPSS laser. Average power of the lasers range from 0.5 Watts to 7 Watts with the laser wavelength of 355nm. The laser repetition rates range from 0 to 200 kHz.

The choice of laser power depends upon the process throughput requirements and cut quality.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

Laser Cutter 0.5-355

The Resonetics Laser Cutter 0.5-355 is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter 0.5-355 utilizes a DPSS laser operating at 1W at 60 KHz at a laser wavelength of 355nm.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

Laser Cutter 7-355

The Resonetics Laser Cutter 7-355 is a diode-pumped solid-state (DPSS) laser-based  micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.

The Laser Cutter 7-355 utilizes a DPSS laser operating at 7W at 60 KHz at a laser wavelength of 355nm.

The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter.  The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.

The system offers several options such as autofocus and automated machine vision for part alignment and inspection.

Applications

  • Flexible Circuit excising
  • Polymer circuit excising
  • Via hole drilling
  • Slot hole drilling

Materials

  • Polymers
  • Adhesives

Machining Capabilities

  • Part singulation
  • Via hole drilling
  • Slot Hole drilling
  • Laser Cutting and trimming

Contact Resonetics for system specifications
and technical details.

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CO2 Router

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