Laser Systems
Resonetics Laser Systems Division designs and manufactures turnkey laser micromachining systems for the Scientific and Industrial markets.
In addition to the standard products, the Laser Systems Division offers laser system integration services to integrate a laser source (diodepumped solid state, excimer, CO2, picoseconds and femtosecond lasers) into a turnkey workstation for customer application
|
 |
CO2 Laser System
- Short pulse 250 watt CO2 Laser
- Short pulse 400 watt CO2 Laser
- Short pulse 500 watt CO2 Laser
- High quality cuts and precise dimensional tolerances Welded frame for stability
- Market leader in laser micromachining systems
- State of the Art Design
- The Router design allows for high duty cycle processing of a wide variety of materials.
- Ability to perform non-linear profile cutting of circles, arcs or other complex patterns.
- Proven leader in non-contact laser processing of silicon wafers and other semiconductor materials.
- A small footprint design enables easy set-up and serviceability. The unique design of the Router
provides the maximum flexibility in any work
environment.
- Convenient programming software to allow rapid conversion of CAD drawings to finished parts.
Innovative Features
- Non-contact laser process to cut silicon wafers and other semiconductor materials
- Cuts arcs, circles, inside cut outs,rectangles or any complex pattern
- Narrow kerf width
- Typical cutting speed 0.2”/sec (5mm/sec)
- Class 1 safety enclosure
- Optical viewing system with CCTV monitor
- Optional wafer cassette auto loading/unloading
Materials
- Silicon
- Alumina (ceramic)
- Fused silica
- Aluminum nitride
- Gallium arsenide
- CVD Diamond
- PZT ceramic
- Thin metals and oxides
- Polymide Tubing
- Silicon Tubing
|
|
 Download Specification Sheet
|
|
