Semiconductor OEM Components

Semiconductor components are used in OEM equipment for the manufacturing of micro-chips. These high value semiconductor equipment utilize specialized ceramic-based components.

Resonetics lasers drill high precision, high tolerance holes, blind holes and channels in ceramic materials to meet specific properties of these highly specialized components.

Material Type:	Alumina and Similar Ceramics
Material thickness (maximum):	0.040"
Hole diameter	0.005" to 0.020" +/- 0.001"
Hole Depth and Tolerance:	up to 0.040" (through holes - tolerance n.a.)

Laser machining of ceramic materials is commonplace. The Resonetics Laser Router is a standard tool used to drill vias in ceramic materials. However in the Semiconductor OEM Components Group, the hole diameter tolerances are much tighter compared with CO2 machining.

The core competency of the Semiconductor OEM Components group is to laser machine ceramic materials with dimensions and tolerances much tighter than conventional laser technology