<!DOCTYPE html PUBLIC "-//W3C//DTD XHTML 1.0 Strict//EN" "http://www.w3.org/TR/xhtml1/DTD/xhtml1-strict.dtd"> <html xmlns="http://www.w3.org/1999/xhtml"> <head> <title>Resonetics - Materials</title> <!-- Begin Meta Content --> <meta http-equiv="Content-Type" content="text/html; charset=UTF-8" /> <meta name="Description" content="Laser micromachining technology and contract manufacturing for medical device, packaging, microfluidic, electronic, aeronautic and semiconductor industry, handling bioresorbable, bioabsobable, polymers, PVDF, PVAC, PMMA, PLLA, using 193 nm wavelength excimer lasers. stents, embolic filters, catheters and other medical devices." /> <meta name="Keywords" content="laser micromachining, microfabrication, micromachining, micro machining, laser drilling, laser cutting, contract manufacturing, prototyping, rapid prototyping, medical device, medical device manufacturing, stent, stents, drug-eluting stents" /> <!-- End Meta Content --> <!-- Begin JavaScript Links --> <script type="text/javascript">AC_FL_RunContent = 0;></script> <script src="../scripts/AC_RunActiveContent.js" type="text/javascript"></script> <script type="text/javascript" src="../scripts/DivExpandingContent.js"></script> <script type="text/javascript" src="../scripts/LightBox.js"></script> <!-- End JavaScript Links --> <!-- Begin Style Sheet Links --> <link href="../style/style01.css" rel="stylesheet" type="text/css" media="screen, projection" /> <link href="../style/links01.css" rel="stylesheet" type="text/css" media="screen, projection" /> <link href="../style/styleprint.css" rel="stylesheet" type="text/css" media="print" /> <link href="../icon/resonetics.ico" rel="shortcut icon" /> <link rel="stylesheet" href="../style/LightBox.css" type="text/css" media="screen" /> <!--[if IE 6]> <link rel="stylesheet" href="../style/ie_fixes.css" type="text/css" media="screen, projection" /> <![endif]--> <!-- End Style Sheet Links --> </head> <body> <table width="100%" border="0" cellpadding="0" cellspacing="0"> <tr> <td align="center"><table class="Width980" border="0" cellspacing="0" cellpadding="0"> <tr> <td></td> </tr> <tr> <td></td> </tr> <tr> <td><?php include("../templates/ResoneticsHeader01.html"); ?> <?php include("../templates/ResoneticsHeaderPrint.html"); ?></td> </tr> <tr> <td><?php include("../templates/NavigationBars.html"); ?></td> </tr> <tr> <td>&nbsp;</td> </tr> <tr> <td><table class="Width980" border="0" cellpadding="0" cellspacing="0"> <tr> <td align="left" valign="top"><table id="ContainerTable" border="0" cellspacing="0" cellpadding="0"> <tr> <td class="WhiteCell" valign="top"><div class="Column370"> <h1>Materials</h1> <div id="DivExpandingContent"> <table width="230" border="0" cellspacing="0" cellpadding="0"> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Plastics" rev="Plastics2">Polymers and Plastics </a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Bioabsorbable1" rev="Bioabsorbable2">Bioabsorbable</a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Ceramics" rev="Cermaics2">Ceramics</a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Metals" rev="Metals2">Metals</a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="CVD" rev="CVD2">CVD Diamond and Precious Materials</a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Glass" rev="Glass2">Glass Materials</a></td> </tr> <tr> <td align="left" valign="middle" class="BlueButton01"><a href="#" rel="Semiconductor1" rev="Semiconductor2">Semiconductor Materials</a></td> </tr> </table> </div> <p>&nbsp;</p> </div></td> <td valign="top"><img src="../images/SpacerBox15.gif" alt="SpacerBox" class="SpacerBox15" /></td> <td valign="top" class="WhiteCell"><div class="Column370"> <div id="Plastics"> <h2>Plastics</h2> <h3> Polymers and Plastics</h3> Resulting vias and shapes may be arranged as arrays of thousands of elements <p>Laser micromachining of plastics is a well-established area where there is a defined and well-accepted technology match.</p> <h3>Compatible materials include:</h3> <table width="340" border="0" cellspacing="0" cellpadding="0"> <tr> <td align="left" valign="top" style="width:170px">FEP<br /> Parylene<br /> PET<br /> PMMA<br /> Polycarbonate<br /> Polyester</td> <td align="left" valign="top" style="width:170px">Polyethylene<br /> Polyimide<br /> Polyurethane<br /> PVA<br /> Teflon<br /> Pellathane</td> </tr> </table> <p>If you have an application involving one of these materials or another plastic composite and you wish to:</p> <h3>Laser Stripping</h3> <p>Laser stripping of plastic insulation from a wire conductor or a metal braid is a classic laser micromachining application. Laser stripping is a selective process. The laser energy density to ablate or remove a polymer insulator is an order magnitude lower than a metal conductor. This means that once the laser beam ablates through the polymer insulator and reaches the underlying metal conductor or braid, the laser beam can continually &quot;hit&quot; the metal layer without any risk of damage. The laser can be tuned to &quot;selectively&quot; remove on material without affecting the underlying material.</p> <p>The laser stripping process removes the polymer insulation layer-by-layer. Each time the laser pulses, a layer as thin as 0.1 micron can be removed.</p> <p>Laser stripping can be performed as an &quot;end strip&quot; or &quot;mid-span&quot; strip. There is typically a 5 degree taper angle at the transition cone from the insulator to the stripped region.<br /> Typical polymer insulation thickness varies from 0.0002&quot; to 0.040&quot; with the metal conductor or braid thicker than the insulation layer.</p> <p>Laser Stripping is performed on Laser Stripping Systems which are generally configured with long length optical modules (up to 300mm in length) so that the entire strip length can be machined at one time. The beam is formed as a long thin line where the beam length is the strip length and the beam width is the outer diameter of the wire or mesh assembly. The laser beam is homogenized (guaranteed energy distribution along the entire length of the strip region) to ensure all the organic material is removed, especially at the transition zone between stripped and non-stripped area. Often this transition zone is conical in shape with limited taper. This method offers superior process reliability and consistency than moving a small beam back and forth along the wire length where beam overlap affects the process quality.</p> <p>The wire can be put on a balloon drilling system where the wire is secured by collets and rotated through the beam. The laser beam can be split by an optical setup so that two (2) beams ablate the wire at 180 degrees orientation. Or the laser beam can be split into three (3) beams so that the angular separation between beams is 120 degrees.</p> <p>Laser stripping is used in many medical device applications where either an electrical contact is required or the outer jacket needs to be partially removed to provide device flexibility. For high volume applications, the wires are stripped in an automated part handler such as reel-to-reel or reel-to-part. The Laser Stripping system can both strip and cut the wire to length, with in-situ metrology to measure the strip region and wire length.</p> <p>Applications include cardiac rhythm disease leads (pacemakers, ICD, heart failure), electrophysiology ablation devices, embolic protection and guide catheters, among others.</p> <h3>Laser Cutting Bioabsorbable or Polymer Stents</h3> <p>Metal stents represent a significant improvement to combat atherosclerosis, the most common cause of coronary artery blockage. However the implantation of metal-based devices can still result in stent thrombosis and there can be challenges to correctly size the stent inside the artery. The advent of drug-eluting metal stents has reduced restenosis rates but there is evidence of sub acute and late thrombosis.</p> <p>One of the promising technologies to improve in-stenting and to reduce repeat revascularization is the bioabsorbable or polymer stent. Once deployed, the bioabsorbable stent will dissolve back into the bloodstream and leave a healed artery, potentially eliminating late stent thrombosis because the stent is gone.</p> <p>Laser cutting of bioabsorbable or polymer stents is performed on proprietary Stent Cutting Systems in Class 100,000 clean room(s). Similar to a metal stent cutting system, the polymer tube is held by pneumatic-controlled collets and rotated by direct drive stages in the circumferential direction. The entire tooling is mounted on XY stages to provide three degrees of freedom (X,Y, Theta).</p> <p>Resonetics provides design guidelines of laser-cut bioabsorbable or polymer stents to help the device engineer. Quality engineers use various metrology tools to help characterize the laser process.</p> <p>Since the bioabsorbable material is susceptible to moisture and humidity, the raw material material is stored in a dry nitrogen box. Precautions are taken during laser cutting to ensure the material is environmentally protected. After laser cutting, the laser-cut bioabsorbable stent is packaged in vacuum-sealed bags with optional desiccant.</p> <h3>Laser Singulation, kiss  cutting or de-gating</h3> <h6>of Polymer-based devices</h6> <p>Laser Cutting, Laser Singulation, kiss  cutting or de-gating of polymer-based devices is performed on Laser Cutter Systems that deploy diode-pumped solid-stated laser (DPSS) operating at a laser wavelength of 266nm or 355nm.</p> <p>Traditionally polymer devices are cut into individual devices by dies, mechanical sheers, scalpels or razor blades. The array of polymer devices can be presented in many configurations such as a flexible printed circuit, mold tree, spun-coated onto a glass substrate. In the case of printed circuits, tight positioning tolerances relative to specific features may require machine vision to singulate the devices precisely. For mold tree, flash or thin polymer webbing may need to be trimmed from the individual device. These flash artifacts will vary from part to part, requiring machine vision to de-gate the devices. If the polymer device is spun-coated on to a glass substrate, then traditional mechanical means will not work as a kiss cut  is required peel away the polymer device from the underlying substrate.</p> <p>Lasers are very adapt to perform a kiss cut  since the laser can be pulsed a prescribed number of pulses to etch through the top layer without damaging the underlying layer. Lasers can be used to not only to separate polymer devices from glass but from another adhesive-backed plastic liner. This is common for reel-to-reel applications.</p> <p>Diode-pumped solid-state lasers operating in the deep UV (ultra-violet spectrum) are suitable laser sources because they are high repetition rate lasers that direct write a small spot (typically as small as 10 to 15 microns in diameter). The laser beam follows the path of the cut out, much like a die cut except there is no tool wear. By operating at laser wavelength of 266nm or 355nm, the polymer devices is ablated  or vaporized, with little melting or debris resulting from the cut.<br /> The Laser Cutter systems deploy galvos (spinning XY mirrors) to deflect the laser beam at high speeds, using XY motions stages to index the device array. Machine Vision and through-the-lens camera system helps to provide both global and individual part alignment.</p> <p>For certain medical applications involving ETFE, fabric, silicone rubber, laser singulation is accomplished using a CO2 Router System. Unlike the Laser Cutter System that ablates material, the Router deploys a thermal process using a short pulse CO2 laser. The laser liquefies the material and forces the material out the back side using gas assist.</p> Laser singulation, kiss-cutting or degating of polymer devices is used in a wide variety of applications, ranging from cardiac rhythm management, electrophysiology, diabetes management, medical electronics and bioabsorbable implants, among others. <h3>&nbsp;</h3> <h3>Cutting</h3> <h3>Microdrilling</h3> <h3>Skiving</h3> <h3>Stripping<br /> </h3> </div> <div id="Bioabsorbable1"> <h2>Bioabsorbable</h2> <ul> <li>Poly-l-lactic Acid (PLLA) </li> <li>Polycaprolactone (PCL) </li> <li>Polyglycolic Acid (PGA)</li> <li>Consumer Specific Materials</li> </ul> </div> <div id="Ceramics"> <h2>Cermaics</h2> <h3> Micromachining of Hard Materials</h3> <p>Laser scribing of ceramic materials is a well-established field. However, laser micromachining of ceramics is a growing field, expecially in the fields of micro-electronics packaging and communications.</p> <h3>Compatible materials include:</h3> <p>Alumina<br /> Aluminum Nitride<br /> Ceramic Composites<br /> PZT<br /> Green and fired<br /> Zirconia</p> <p> If you have an application involving one of these materials or similar composite material and you wish to:</p> <h3>Etch</h3> <ul> <li> channels or blind grooves</li> <li>or skive a tube</li> <li>a slot in a tube </li> </ul> <h3>Micro Drill<br /> </h3> <ul> <li>a single precise hole</li> <li>an array of holes</li> <li>a blind hole </li> </ul> <h3>Micro Mill</h3> <ul> <li>a linear or complex pattern</li> </ul> <h3>Surface</h3> <ul> <li>roughen a material to improve bonding</li> </ul> <h3>Mark</h3> <ul> <li>a permanent logo or bar code</li> </ul> <h3>Cut</h3> <ul> <li>out a complex pattern</li> <li>out fragile patterns without disrupting<br /> the surrounding area</li> <li>in a very precise location away from the edge </li> </ul> <h3><a href="System_CO2Router.php">Laser Router System</a></h3> </div> <div id="Metals"> <h2>Metals</h2> <h3>Micromachining of Metals</h3> <p>Laser micromachining of thin (less than .040&quot; thick) metals is an emerging field. Traditionally, processes such as mechanical drilling/milling, EDM (Electro Discharge Machining), and Electroforming have been the choices for metal machining. However, there are numerous applications where these technologies are reaching their limitations.</p> <p>If your application has reached one of these limitations, perhaps laser micromachining is a technology match. Please consult us.</p> <h3>Compatible materials include:</h3> <table width="340" border="0" cellspacing="0" cellpadding="0"> <tr> <td align="left" valign="top" style="width:170px">Aluminum<br /> Beryllium Copper<br /> Brass<br /> Copper<br /> Molybdenum</td> <td align="left" valign="top" style="width:170px">Nickel<br /> Stainless Steel<br /> Tantalum<br /> Thin Metal Films<br /> Tungsten</td> </tr> </table> <p>If you have an application involving one of these materials<br /> or another metal composite and you wish to:</p> <h3>Laser Texturing of Metal Stents</h3> <h6>Implants or Catheters</h6> <p>A novel application of lasers involves texturing of metals, polymers and ceramics with tiny mesas or sinusoidal patterns to improve a device performance such as surface adhesion, increased&nbsp; contact area, promotion of tissue growth or machining tiny drug/gene reservoirs.</p> <p>Utilizing a dielectric mask (aluminum deposited on a quartz substrate), an excimer laser can project a complex mesa pattern on to the part. The laser etches away minute portions of material (ie; the material surrounding the mesa), leaving free-standing raised structures that can be a few microns high and few microns square. The cross-section and height of the mesa can be varied by changing the mask or the number of laser pulses.</p> <p>For every material, there is an ablation threshold which is defined as the energy density (measured in J/cm2) where the material ablates or vaporizes. If a UV laser (excimer or diode-pumped solid-state laser) etches a material at this ablation threshold, then surface modification takes place. This surface modification can result in a smoother  surface or a rougher  surface, depending upon the material, fluence and choice of material.</p> <p>Laser texturing of medical devices can be found in applications involving coronary stents, dental implants, peripheral arterial disease and orthopedics, among others.</p> <h3>Cutting<br /> </h3> <ul> <li>channels or blind grooves</li> <li>or skive a tube</li> <li>a slot in a tube </li> </ul> <h3>Micro Drill </h3> <ul> <li>a single precise hole</li> <li>an array of holes</li> <li>a blind hole </li> </ul> <h3><a href="System_LaserCutter.php">Laser Cutter 355-5</a> System<br /> </h3> </div> <div id="CVD"> <h2>CVD Diamond</h2> <h3> Micromachining of CVD Diamond and <br /> Precious Materials</h3> <p>Laser micromachining of CVD diamond and precious materials is a response to ever growing needs for efficient machining of hard, high-valued materials.<br /> There are more areas where these materials are getting routinely used in the industry. Resonetics has gained excellent experience in many of these fields.</p> <h3>Lasers provide cost effective solutions for:</h3> <ul> <li>High precision of material removal</li> <li>Complex patterning</li> <li>High edge quality</li> <li>Via formation with tight tolerances</li> <li>Fine marking</li> </ul> <p> <a href="MicroCutting.php">Micro Cutting</a></p> </div> <div id="Glass"> <h2>Glass</h2> <h3>Glass and Inorganic Materials</h3> <p>Laser Micromachining of glass materials is a relatively new field. In applications where a dry process is necessary, laser micromachining is a viable option. In addition, micromilling of shallow grooves is a natural fit for laser technology.</p> <h3>Compatible materials include:</h3> <p>Fused Silica<br /> Borosilicate<br /> BK7<br /> FPD Materials<br /> Microscope glass slides<br /> Quartz</p> <h3>Etch</h3> <ul> <li> channels or blind grooves</li> <li>or skive a tube</li> <li>a slot in a tube </li> </ul> <h3>Micro Drill</h3> <ul> <li>a single precise hole</li> <li>an array of holes</li> <li>a blind hole </li> </ul> <h3>Micro Mill</h3> <ul> <li>a linear or complex pattern</li> </ul> <h3>Mark</h3> <ul> <li>a permanent logo or bar code</li> </ul> <h3>Cut</h3> <ul> <li>out a complex pattern</li> <li>out fragile patterns without disrupting the <br /> surrounding area</li> <li>in a very precise location away from the edge</li> </ul> <h3><a href="System_RapidX.php">RapidX 250 System</a></h3> </div> <div id="Semiconductor1"> <h2>Semiconductor Materials</h2> <ul> <li>Silicon Wafers</li> <li>Gallium Arsenide</li> <li>Lithium Niobate</li> </ul> <h3><a href="System_CO2Router.php">Laser Router System</a></h3> </div> <p>&nbsp;</p> </div></td> <td valign="top"><img src="../images/SpacerBox15.gif" alt="SpacerBox" class="SpacerBox15" /></td> <td valign="top" class="WhiteCell"><div class="Column210"> <div id="Plastics2"> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Cutting</h5></td> </tr> </table> <p><a href="../pictures/BioabsorbableStent_800.jpg" rel="lightbox" title="Skiving of flexible circuits"><img src="../pictures/BioabsorbableStent_180.jpg" alt="Bio-stent" width="180" height="135" /></a></p> <p>Bioabsorbable Stent</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Micro Drill</h5></td> </tr> </table> <p><a href="../pictures/HoleArrayPolyimide_Full.jpg" rel="lightbox" title="25 micron dia. hole array in Polyimide"><img src="../pictures/HoleArrayPolyimide_180.jpg" alt="25 micron dia. hole array in Polyimide" width="180" height="180" /></a></p> <p>25 micron dia. hole array <br /> in Polyimide</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Skiving</h5></td> </tr> </table> <p><img src="../pictures/LaserSkiving_180.jpg" alt="Laser Skiving" width="180" height="129" /></p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Stripping</h5></td> </tr> </table> <p><a href="../pictures/WireStripped_640.jpg" rel="lightbox" title="Wire Stripped"><img src="../pictures/WireStripped_180.jpg" alt="Wire Stripped" width="180" height="180" /></a></p> </div> <div id="Bioabsorbable2"> <p><a href="../pictures/Balloon001_640.jpg" rel="lightbox" title="Balloon Drilling"><img src="../pictures/Balloon001_180.jpg" alt="Balloon Drilling" /></a></p> <p><a href="../pictures/BioabsorbableStent003_640.jpg" rel="lightbox" title="Bioabsorable Stent"><img src="../pictures/BioabsorbableStent003_180.jpg" alt="Bioabsorable Stent" width="180" height="180" /></a></p> <p><a href="../pictures/BioabsorbableStent004_640.jpg" rel="lightbox" title="Bioabsorable Stent"><img src="../pictures/BioabsorbableStent004_180.jpg" alt="Bioabsorable Stent" width="180" height="180" /></a></p> <p><a href="../pictures/BioabsorbableStent005_640.jpg" rel="lightbox" title="Bioabsorable Stent"><img src="../pictures/BioabsorbableStent005_180.jpg" alt="Bioabsorable Stent" width="180" height="180" /></a></p> </div> <div id="Cermaics2" style="display:block"> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Etching</h5></td> </tr> </table> <p><a href="../pictures/CutAluminaCeramics_Full.jpg" rel="lightbox" title="Cut in Alumina Ceramics"><img src="../pictures/CutAluminaCeramics_180.jpg" alt="Cut in Alumina Ceramics" width="180" height="180" /></a></p> <p>Cut in Alumina Ceramics</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Etching</h5></td> </tr> </table> <p><a href="../pictures/SerpentineCut_Full.jpg" rel="lightbox" title="Serpentine cut in 750 microns thick Ceramics"><img src="../pictures/SerpentineCut_180.jpg" alt="Serpentine cut in 750 microns thick Ceramics" width="180" height="180" /></a></p> <p>Serpentine cut in 750 microns thick Ceramics</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Micro Drill</h5></td> </tr> </table> <p><a href="../pictures/BlindDrilledCeramics_Full.jpg" rel="lightbox" title="25 microns dia. blind via drilled in Ceramics"><img src="../pictures/BlindDrilledCeramics_180.jpg" alt="25 microns dia. blind via drilled in Ceramics" width="180" height="180" /></a></p> <p>25 microns dia. blind via drilled in Ceramics</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Mark</h5></td> </tr> </table> <p><a href="../pictures/FeaturesEtchedAlumina_Full.jpg" rel="lightbox" title="75 micron features etched in Alumina"><img src="../pictures/FeaturesEtchedAlumina_180.jpg" alt="75 micron features etched in Alumina" width="180" height="180" /></a></p> <p>75 micron features etched in Alumina</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Cut</h5></td> </tr> </table> <p><a href="../pictures/HoleInAlumina_Full.jpg" rel="lightbox" title="200 micron dia. hole in 1.1 mm thick alumina"><img src="../pictures/HoleInAlumina_180.jpg" alt="200 micron dia. hole in 1.1 mm thick alumina" width="180" height="180" /></a></p> <p>200 micron dia. hole in 1.1 mm thick alumina</p> </div> <div id="Metals2"> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Etching</h5></td> </tr> </table> <p><a href="../pictures/HoleArray10umExit1_640.jpg" rel="lightbox" title="Exit1-10 um exit 50 um pitch in 25 um TI"><img src="../pictures/HoleArray10umExit1_180.jpg" alt="Exit1-10 um exit 50 um pitch in 25 um TI" width="180" height="180" /></a></p> <p>Exit1-10 um exit 50 um pitch <br /> in 25 um Titanium</p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Etching</h5></td> </tr> </table> <p><a href="../pictures/HoleArray25um_640.jpg" rel="lightbox" title="25 um exit in 50 um Ta"><img src="../pictures/HoleArray25um_180.jpg" alt="25 um exit in 50 um Ta" width="180" height="180" /></a></p> <p>25 um exit in 50 um Tantium</p> </div> <div id="CVD2"> <p><a href="../pictures/EdgeCVDDiamond_Full.jpg" rel="lightbox" title="Edge cut in 500 microns thick CVD Diamond"><img src="../pictures/EdgeCVDDiamond_180.jpg" alt=" Edge cut in 500 microns thick CVD Diamond" width="180" height="180" /></a></p> <p> Edge cut in 500 microns thick CVD Diamond</p> <p><a href="../pictures/CircularCVDDiamond_Full.jpg" rel="lightbox" title="Circular cut in 500 microns thick CVD Diamond"><img src="../pictures/CircularCVDDiamond_180.jpg" alt=" Circular cut in 500 microns thick CVD Diamond" width="180" height="180" /></a></p> <p> Circular cut in 500 microns thick CVD Diamond</p> <p><a href="../pictures/CharacterRuby_Full.jpg" rel="lightbox" title="0.005 in character height etched in a ruby"><img src="../pictures/CharacterRuby_180.jpg" alt=" 0.005&quot; character height etched in a ruby" width="180" height="180" /></a></p> <p> 0.005&quot; character height etched in a ruby</p> <p><a href="../pictures/Edge2CVDDiamond_Full.jpg" rel="lightbox" title="Edge cut in 500 microns thick CVD Diamond"><img src="../pictures/Edge2CVDDiamond_180.jpg" alt=" Edge cut in 500 microns thick CVD Diamond" width="180" height="180" /></a></p> <p> Edge cut in 500 microns thick CVD Diamond</p> </div> <div id="Glass2"> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Micro Drill</h5></td> </tr> </table> <p><a href="../pictures/PatternSilicaWafer_Full.jpg" rel="lightbox" title="Complex array pattern cut in 6&quot; dia. fused silica wafer"><img src="../pictures/PatternSilicaWafer_180.jpg" alt="Complex array pattern cut in 6&quot; dia. fused silica wafer" width="180" height="180" /></a></p> <p>Complex array pattern cut in 6&quot; dia. fused silica wafer </p> <table width="180" border="0" cellspacing="0" cellpadding="0"> <tr> <td valign="middle" class="DarkBlueBar01"><h5>Micro Mill</h5></td> </tr> </table> <p><a href="../pictures/MicronCells_Full.jpg" rel="lightbox" title="100 micron cells with 5 micron line widths"><img src="../pictures/MicronCells_180.jpg" alt="100 micron cells with 5 micron line widths" width="180" height="180" /></a></p> <p>100 micron cells with 5 micron line widths<br /> </p> </div> <div id="Semiconductor2"> <p><a href="../pictures/Wafer_640.jpg" rel="lightbox" title="Wafer"><img src="../pictures/Wafer_180.jpg" alt="Wafer" /></a></p> <p><a href="../pictures/WaferCutting_640.jpg" rel="lightbox" title="Wafer Cutting"><img src="../pictures/WaferCutting_180.jpg" alt="Wafer Cutting" width="180" height="180" /></a></p> </div> <p>&nbsp;</p> </div><script type="text/javascript"> var Content001=new ddtabcontent("DivExpandingContent") Content001.setpersist(true) Content001.setselectedClassTarget("link") //"link" or "linkparent" Content001.init() </script></td> </tr> </table></td> </tr> </table> <br /></td> </tr> <tr> <td><?php include("../templates/FooterBar.html"); ?></td> </tr> </table> <br /> <br /> <br /> </td> </tr> </table> </body> </html>=