Laser Router Series
The Resonetics Laser Router Series is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router Series is available in three (3) system configurations: Laser Router 250, Laser Router 400 and Laser Router 500, depending upon the average power of the CO2 laser. Average power of the lasers range from 250 Watts to 500 Watts with a laser repetition rates up to 100kHz.
The Laser Router offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 20mil (500 microns) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router Series is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 250
The Resonetics Laser Router 250 is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 250 is based upon a short pulse 250 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 250 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 25mil (500 microns) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 250 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 400
The Resonetics Laser Router 400 is a cost-effective short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 400 is based upon a short pulse 400 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 400 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil in a 25mil (500 micron) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 400 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
Laser Router 500
The Resonetics Laser Router 500 is a short pulse CO2 laser-based drilling system designed to drill vias and slots in ceramic circuit boards for microwave and milliwave thin film hybrid components, used in the communication, military, optical and aerospace markets. The Router can drill ceramic substrates up to 60 mils thickness with vias as small as 75 microns (3 mils) in diameter.
The Laser Router 500 is based upon a short pulse 500 Watt CO2 Laser with a laser repetition rates up to 100kHz.
The Laser Router 500 offers the smallest taper of any laser-drilled feature. Utilizing the proprietary StraightTaper technology, the Laser Router can drill vias or slots in substrates with a taper of less than 1 mil (25 microns) in a 25mil (500 micron) thick substrate. By drilling low taper features, this unique capability maximizes the available real estate on the circuit board.
The Laser Router 500 is designed for machining substrates as large as 300mm x 300mm utilizing a standard 300mm x 300mm XY stages with optional Z axis, rotary stage and boring head, permitting the most complex geometries to be machined, The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as a boring head and machine vision for automated alignment.
Applications
- Thin Film Circuits
- Microwave Circuits and Interconnects
- Milliwave Circuits and Interconnects
- Single and Multi-layer capacitors
- Die attach adhesives
Materials
- Alumina
- Aluminum Nitride
- Specialty ceramics
- Borosilicate Glass
- Sapphire
- Adhesives
Machining Capabilities
- Via Hole Drilling
(as small as 3 mils or 75 microns diameter)
- Slot Drilling
- Singulation of devices
Contact Resonetics for system specifications
and technical details.
OLED Laser Ablation Tool
The Resonetics OLED Laser Ablation Series is a family of laser systems designed to meet advanced research, development, prototype, pilot production and manufacturing of Organic LEDs (OLED), Polymer LEDs (PLED) and flexible display devices. The OLED Laser Ablation system selectively patterns polymer & thin metal films on ITO/Glass and silicon substrates. The laser system exposes contact pads, wire bond pads as well as isolates and singulates individual display devices.
Download Technical Paper
The OLED Laser Ablation Series is developed to
- Maximize display life span
- Show a pathway to high volume automation
- Provide design versatility
Key System Features
- Proprietary debris nozzle designed to keep the active display area debris free
- Nitrogen process enclosure to prevent oxygen or water vapor from contaminating the display devices
- Robot effector interface to production equipment, such as polymer spinners and evaporators
- Single Stop Solution to handle from advanced research & development to high volume production
- Metrology, machine vision and auto-alignment options to maximize throughput
Laser Ablation Process
The ultra-violet laser beam etches away the overlying polymer or thin film metal from the substrate without damage. This is accomplished by a phenomena called "ablation" where the laser beam breaks the material's molecular bonds, resulting in the high velocity ejection of the "vaporized" materials into the collection path of the debris nozzle. This material removing process is done in a closed-cycle nitrogen environment to maximize the device lifespan.
Laser Cutter Series
The Resonetics Laser Cutter Series is a diode-pumped solid-state (DPSS) laser-based micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.
The Laser Cutter Series is available in two (2) system configurations: Laser Cutter 0.5-355 and Laser Cutter 7-355, depending upon the average power of the DPSS laser. Average power of the lasers range from 0.5 Watts to 7 Watts with the laser wavelength of 355nm. The laser repetition rates range from 0 to 200 kHz.
The choice of laser power depends upon the process throughput requirements and cut quality.
The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter. The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as autofocus and automated machine vision for part alignment and inspection.
Applications
- Flexible Circuit excising
- Polymer circuit excising
- Via hole drilling
- Slot hole drilling
Materials
Machining Capabilities
- Part singulation
- Via hole drilling
- Slot Hole drilling
- Laser Cutting and trimming
Contact Resonetics for system specifications
and technical details.
Laser Cutter 0.5-355
The Resonetics Laser Cutter 0.5-355 is a diode-pumped solid-state (DPSS) laser-based micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.
The Laser Cutter 0.5-355 utilizes a DPSS laser operating at 1W at 60 KHz at a laser wavelength of 355nm.
The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter. The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as autofocus and automated machine vision for part alignment and inspection.
Applications
- Flexible Circuit excising
- Polymer circuit excising
- Via hole drilling
- Slot hole drilling
Materials
Machining Capabilities
- Part singulation
- Via hole drilling
- Slot Hole drilling
- Laser Cutting and trimming
Contact Resonetics for system specifications
and technical details.
Laser Cutter 7-355
The Resonetics Laser Cutter 7-355 is a diode-pumped solid-state (DPSS) laser-based micromachining system designed to singulate polymer-based circuits from polymer, glass, ceramic or metal-based substrates.
The Laser Cutter 7-355 utilizes a DPSS laser operating at 7W at 60 KHz at a laser wavelength of 355nm.
The Laser Cutter series is designed to singulate devices from a substrate with a maximum size of 300mm x 300mm. The typical laser spot size is 10 to 15 microns in diameter. The system is comprised of 300mm x 300mm XY stages with optional Z axis, rotary and optical scanner, permitting the most complex geometries to be machined. The system includes a user-friendly CAD conversion software package to allow the CAD drawing to be converted directly to machine code. The system has a camera vision system for part alignment and process viewing.
The system offers several options such as autofocus and automated machine vision for part alignment and inspection.
Applications
- Flexible Circuit excising
- Polymer circuit excising
- Via hole drilling
- Slot hole drilling
Materials
Machining Capabilities
- Part singulation
- Via hole drilling
- Slot Hole drilling
- Laser Cutting and trimming
Contact Resonetics for system specifications
and technical details.
