Micromachining of Hard Materials
 

Laser scribing of ceramic materials is a well-established field.   However, laser micromachining of ceramics is a growing field, expecially in the fields of micro-electronics packaging and communications.

Compatible materials include:

 Click on Picture
to see
ENLARGED VIEW

 Cut in Alumina Ceramics
Cut in
Alumina
Ceramics

 

Alumina

Aluminum Nitride

Ceramic Composites

PZT

Green and fired

Zirconia

  If you have an application involving one of these materials or similar composite material and you wish to:
 

  Serpentine cut in 750 microns thick Ceramics
Serpentine cut in
750 microns
thick Ceramics

 

 Etch
 


channels or blind grooves

or skive a tube

a slot in a tube

 

 25 Microns diameter blind via drilled in Ceramics
25 microns dia.
blind via drilled
in Ceramics

 Micro Drill
 


a single precise hole

an array of holes

a blind hole

 


75 micron
features etched
in Alumina


200 micron
dia. hole in
1.1 mm thick
alumina

Click Here
for the

 Fast Track to Micro Cutting

 Micro Mill
  a linear or complex pattern

Surface
  roughen a material to improve bonding

Mark
  a permanent logo or bar code

Cut
 

out a complex pattern

out fragile patterns without disrupting the surrounding area

in a very precise location away from the edge

   

MICROMACHINING TECHNOLOGY PLATFORM (MTP®)
Drilling, Cutting, Scribing with CO2 Lasers

Click Here for the Fast Track to Maestro Systems

Click here for the Fast Track to Impressario Systems

Click here for the Fast Track to MicroMaster System


Corporate Headquarters
 
E-mail: Sales@Resonetics.com

4 Bud Way
Nashua, NH 03063 USA
Phone:
603-886-6772
Fax:
603-886-3655

© 2006 RESONETICS, INC.Contact Us for More Information

 

RESONETICS is the leading excimer laser system excimer laser micromachining laser micromaching and excimer laser systems company in the US. Our technology includes laser micromachinig for the pinhole laser slots national aperture laser milling micro milling laser drilling laser micro hole drillling dicing laser strippping wire stripping laser etching laser marking excising semiconductor ink jet nozzles ink jet gaskets x-ray apertures pinholes data storage counterfeit protection silicon machining silicon drilling silicon hole drilling silicon etching silicon wafer industry PWB PCB ic repair mask repair thin film removal trimming catheter drilling cather skiving skiving catheter oray nozzle spray nozzle IV drips IV orifices dna analysis dna sequencing microfluidics micro channels biomedical applications filters micro filters calibration calibration devices calibration techniques condom drilling condom testing calibration services electrophysiology semiconductor diagnostic targets medical device industry. Material include but are not limited to polyimide parylene ceramic aluminum nitride borosilicate plastics pzt ceramic aluminum nitorde aluminum nitride FPD FPC C4 MCM metal cvd diamond GaAs gaas gallium arsenide.